Spherical Silica Powder

Spherical Silica Powder with SiO₂ ≥99.6%, spheroidization rate ≥90% and whiteness ≥90%. Particle size ranges from 2μm to 42μm, and mixed grades are available. It features low electrical conductivity, low impurity, good flowability and high filling capacity with stable pH value and strictly‑controlled magnetic foreign bodies. Widely used for electronic materials such as epoxy molding compound and copper clad laminate. Shelf‑life: 12 months under sealed and dry storage.

• Mainly used as filler for epoxy plastic packaging materials and copper clad laminates
• applied in electronic encapsulation
• CCL and electronic insulating composite materials.