QDGF-Q40
D50:42.0±4.0μm, SiO₂≥99.6%, spheroidization rate ≥90%, whiteness ≥90. Electrical conductivity ≤5μS/cm. Large‑size spherical powder with good flowability and high filling efficiency.
Inquire Now- Mainly used as filler for epoxy molding compound and copper clad laminate
- applied in electronic encapsulation
- CCL and electronic insulating composite materials.