Silica Powder Series

Soft composite silica powder is produced via special composite modification technology. It features moderate hardness, low ionic impurities and excellent dielectric properties. The powder boasts good fluidity and causes little abrasion to processing equipment. With low oil absorption and high filling capacity as well as high whiteness, it offers great compatibility with various formulas. It effectively improves dimensional stability and reduces shrinkage of finished products, widely used in electronic packaging, copper clad laminates, silicone rubber, coatings and engineering plastics.

Low expansion and dielectric loss for CCL and packaging.

High purity silica powder series are precision-graded products manufactured from high-purity crystalline silica. With SiO₂ purity ranging from 99.95% to 99.99% and ultra-low impurity levels, the series features excellent dielectric properties, low coefficient of linear expansion, and stable thermal conductivity and refractive index. Available in multiple particle size specifications across G-series and R-series, with Mohs hardness of 6.0 and density of 2.2×10³ kg/m³, it meets the precise particle size distribution requirements of various industries.

This series of high purity quartz powder features SiO₂ content up to 99.99% with strictly controlled impurities including Al, Fe, Na⁺ and Cl⁻. It has Mohs hardness of 7.0, excellent dielectric property, good thermal conductivity and chemical stability. Available D50 ranges from 5.2‑25.5 μm with well‑controlled particle‑size distribution. Thanks to superior insulating performance, it serves high‑end industries such as electronics, optics and semiconductors with strict purity requirements.

Crystalline silica powder is processed from natural crystalline quartz with SiO₂ content 99.6%‑99.8% and low impurity level. Mohs hardness 7.0. It features stable dielectric property, low linear expansion coefficient, good thermal conductivity and high refraction coefficient. Multiple particle‑size grades are available with controllable particle‑size distribution, good powder flowability and excellent filling performance with cost‑effective advantage. Widely applied in EMC packaging, painting, semiconductor, optics, aviation electronics and fine chemical industry.

This series of fused silica sand is produced from high‑purity silica raw materials through high‑temperature fusion. Its SiO₂ content reaches up to 99.94%. It features ultra‑low linear thermal expansion coefficient, excellent dielectric property and high Mohs hardness. Multiple mesh grades ranging from 4‑20 mesh to 200‑0 mesh are available with well‑controlled impurities and outstanding thermal stability & insulation performance. Suitable for demanding applications in refractory, optics, electronics and solar crucible industries. Custom packaging is acceptable.

Spherical Silica Powder with SiO₂ ≥99.6%, spheroidization rate ≥90% and whiteness ≥90%. Particle size ranges from 2μm to 42μm, and mixed grades are available. It features low electrical conductivity, low impurity, good flowability and high filling capacity with stable pH value and strictly‑controlled magnetic foreign bodies. Widely used for electronic materials such as epoxy molding compound and copper clad laminate. Shelf‑life: 12 months under sealed and dry storage.