Copper Clad Laminate & Electronic Insulation
For copper clad laminates, insulating boards, epoxy casting and electronic packaging materials, focusing on low impurities, low dielectric loss, insulation and dimensional stability.
- Low impurity control
- Stable dispersion
- Mass production consistency
Suitable Product Series
Application Selection FAQ
- How to select D50 for this application?
- For Copper Clad Laminate & Electronic Insulation, select materials against your required particle size, dispersion, flame-retardant performance and processing conditions. Contact Origin Chemical for a formulation-specific recommendation.
- How to balance whiteness and loading ratio?
- For Copper Clad Laminate & Electronic Insulation, select materials against your required particle size, dispersion, flame-retardant performance and processing conditions. Contact Origin Chemical for a formulation-specific recommendation.
Need help matching materials to your application?
Request a Recommendation