Copper Clad Laminate & Electronic Insulation
For copper clad laminates, insulating boards, epoxy casting and electronic packaging materials, focusing on low impurities, low dielectric loss, insulation and dimensional stability.
- Low impurity control
- Stable dispersion
- Mass production consistency
Suitable Product Series
Amino Silane Series
Amino silane is one of the most widely‑used functional silane coupling agents. It contains active amino groups and hydrolyzable alkoxy groups, acting as an interfacial bridge between inorganic and organic phases. It modifies inorganic fillers and glass fibers, greatly improving wetting and dispersion in epoxy, phenolic, nylon and other resins. It enhances bonding strength, mechanical properties and hot‑humid resistance of composites with high reactivity for various industrial formulations.
Learn MoreApplication Selection FAQ
- How to select D50 for this application?
- For Copper Clad Laminate & Electronic Insulation, select materials against your required particle size, dispersion, flame-retardant performance and processing conditions. Contact Origin Chemical for a formulation-specific recommendation.
- How to balance whiteness and loading ratio?
- For Copper Clad Laminate & Electronic Insulation, select materials against your required particle size, dispersion, flame-retardant performance and processing conditions. Contact Origin Chemical for a formulation-specific recommendation.
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