QDGF-Q30
D50:32.0±4.0μm, SiO₂≥99.6%, spheroidization rate ≥90%, whiteness ≥90. S.S.A.0.4±0.15m²/g, electrical conductivity ≤5μS/cm. Low specific surface area, outstanding flowability, suitable for high‑filling system.
Inquire Now- Mainly used as filler for epoxy molding compound and copper clad laminate
- applied in electronic encapsulation
- CCL and electronic insulating composite materials.