QDGF-Q02
D50:2.0±0.5μm, SiO₂≥99.6%, spheroidization rate ≥90%, whiteness ≥90. S.S.A. 8.0±1.5m²/g, electrical conductivity ≤20μS/cm. Strict control on magnetic foreign bodies, low impurities and excellent flowability, ideal filler for high‑end electronic encapsulation.
Inquire Now- Mainly used as filler for epoxy molding compound and copper clad laminate
- applied in electronic encapsulation
- CCL and electronic insulating composite materials.