QDGF-MQ2
Blended Spherical Silica Powder, D50:22.0±2.0μm, SiO₂≥99.6%, spheroidization rate ≥90%, whiteness ≥90. S.S.A.2.0±0.5m²/g, electrical conductivity ≤5μS/cm. Graded blending to improve powder packing performance.
Inquire Now- Mainly used as filler for epoxy molding compound and copper clad laminate
- applied in electronic encapsulation
- CCL and electronic insulating composite materials.