QDGF-Q20
D50:23.0±5.0μm, SiO₂≥99.6%, spheroidization rate ≥90%, whiteness ≥90. S.S.A.1.0±0.3m²/g, electrical conductivity ≤5μS/cm. Uniform particle‑size distribution, low impurity and high filling rate.
Inquire Now- Mainly used as filler for epoxy molding compound and copper clad laminate
- applied in electronic encapsulation
- CCL and electronic insulating composite materials.