QDGF-MQ1
Blended Spherical Silica Powder, particle size 14.0‑18.3μm, SiO₂≥99.6%, spheroidization rate ≥90%, whiteness ≥90. S.S.A.2.4±0.3m²/g, electrical conductivity ≤3.5μS/cm. Blended particle size for optimized packing density, match special formula requirements.
Inquire Now- Mainly used as filler for epoxy molding compound and copper clad laminate
- applied in electronic encapsulation
- CCL and electronic insulating composite materials.