QDGF-F70
SiO₂≥99.95%, D50=72.5 μm, highest‑purity grade of this series, large‑size fused silica powder with ultra‑low impurities and low thermal expansion. Suitable for refractory materials and special chemical composite materials.
Inquire Now- CCL filler
- EMC electronic packaging
- High‑grade refractory materials
- Optics and aviation components
- Electronics & chemical composite materials