QDGF-F30
SiO₂≥99.85%, D50=29.5 μm, produced by fusion technology. Low thermal expansion and low dielectric loss with excellent powder flowability. Mostly applied for refractory materials, electronic packaging and composite filling.
Inquire Now- CCL filler
- EMC electronic packaging
- High‑grade refractory materials
- Optics and aviation components
- Electronics & chemical composite materials