QDGF-F08
SiO₂≥99.8%, D50=8.5 μm, high‑purity fused quartz powder. Low thermal expansion, low dielectric loss, well‑controlled impurities and favorable processing flowability. Widely used in electronic packaging, CCL and refractory composite materials.
Inquire Now- CCL filler
- EMC electronic packaging
- High‑grade refractory materials
- Optics and aviation components
- Electronics & chemical composite materials