QDGF-F05
SiO₂≥99.8%, D50=5.2 μm, produced from high‑purity quartz under high‑temperature fusion. Low‑impurity, low thermal expansion, low dielectric loss and good powder flowability.
Inquire Now- CCL filler
- EMC electronic packaging
- High‑grade refractory materials
- Optics and aviation components
- Electronics & chemical composite materials