
QDGF-C30
SiO₂ 99.6%, D50=30.3μm, large‑particle specification with high loading and outstanding wear‑resistance, cost‑effective. Suitable for molding compound, coatings and chemical fillers requiring high hardness and high filling content.
Inquire Now- EMC semiconductor packaging materials
- industrial coatings
- optical components
- avionics
- electronics & electrical
- fine‑chemical fillers.

