QDGF-C30

QDGF-C30

SiO₂ 99.6%, D50=30.3μm, large‑particle specification with high loading and outstanding wear‑resistance, cost‑effective. Suitable for molding compound, coatings and chemical fillers requiring high hardness and high filling content.

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  • EMC semiconductor packaging materials
  • industrial coatings
  • optical components
  • avionics
  • electronics & electrical
  • fine‑chemical fillers.