QD-QL40

QD-QL40

spherical alumina powder, coarse D50 50μm particle size, sphericity>95%, ultra-low specific surface area and excellent flowability. Applied in grading filling to maximize powder packing density for ultra-high thermal conductive composites.

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  • Ultra-high thermal conductive potting adhesive
  • high-power heat dissipation materials
  • thick-wall thermal conductive plastics
  • compound fillers for thermal interface materials