QD-QL20

QD-QL20

spherical alumina powder, medium-coarse D50 23μm particle size, sphericity>95%, low specific surface area and excellent flowability. As coarse powder for grading filling, it improves packing efficiency of fillers and greatly enhances thermal conductivity of composites.

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  • High thermal conductive silicone potting adhesive
  • high-power thermal conductive plastics
  • thick thermal pads
  • thermal conductive clads