
QD-QL20
spherical alumina powder, medium-coarse D50 23μm particle size, sphericity>95%, low specific surface area and excellent flowability. As coarse powder for grading filling, it improves packing efficiency of fillers and greatly enhances thermal conductivity of composites.
Inquire Now- High thermal conductive silicone potting adhesive
- high-power thermal conductive plastics
- thick thermal pads
- thermal conductive clads

